TISES Advisory Board
Yu-Po Wang received Ph.D. in Mechanical Engineering from Binghamton University, State University of New York , U.S.A.
In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. He has jointed SPIL since 1998 and led the R&D advanced packaging design team for leadframe, substrate and wafer form packages development.
Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has 83 patents in US.
• 1997-1998 Gintic Institute of Manufacturing Technology, Singapore
• 1998-Present SPIL, Taiwan