TISES Advisory Board
PhD., Material Science & Engineering, Rutgers University, USA
Director, Specialty & Packaging Manufacturing Management (2019.6 ~ Present)
Director, Manufacturing Technology Center, (2015.2~2019.5)
Fab Operations positions, (2003.7-2015.1)
Chris Chern has joined TSMC for over 16 years. During this tenure, he has experienced operation positions as Engineering Manager, Deputy Director, Operation Director, Manufacturing Technology Director, and currently Director of Specialty Manufacturing Management.
His current technical efforts focus on exploring new methodologies of wafer edge yield-up and dppm reduction, SoIC wafer alignment/overlay, nano-scale planarity, process virtual metrology, virtual TEM/SEM, mask metrology, 3D hot-spot prediction, tool platform evolutions for defect and productivity improvements, tool intranet cyber security assurance, and tool-level energy usage reduction.
Prior to joining TSMC, he had broad-based experiences in semiconductor manufacturing, technology transfer, and manufacturing equipment development. Furthermore, he was also involved in US DoD solicited R&D projects of compound semiconductor Laser/LED’s, ferroelectric RAM (FeRAM), para-electric IR detector, and compliant substrate material development for wide bandgap semiconductor-GaN.