TISES Advisory Board
PhD., Material Science & Engineering, Rutgers University, USA
Director, Specialty & Packaging Manufacturing Management (2019.6 ~ Present)
Director, Manufacturing Technology Center, (2015.2~2019.5)
Fab Operations positions, (2003.7-2015.1)
Chris Chern has joined TSMC for over 16 years. During this tenure, he has experienced operation positions as Engineering Manager, Deputy Director, Operation Director, Manufacturing Technology Director, and currently Director of Specialty Manufacturing Management.
His current technical efforts focus on exploring new methodologies of wafer edge yield-up and dppm reduction, SoIC wafer alignment/overlay, nano-scale planarity, process virtual metrology, virtual TEM/SEM, mask metrology, 3D hot-spot prediction, tool platform evolutions for defect and productivity improvements, tool intranet cyber security assurance, and tool-level energy usage reduction.
Prior to joining TSMC, he had broad-based experiences in semiconductor manufacturing, technology transfer, and manufacturing equipment development. Furthermore, he was also involved in US DoD solicited R&D projects of compound semiconductor Laser/LED’s, ferroelectric RAM (FeRAM), para-electric IR detector, and compliant substrate material development for wide bandgap semiconductor-GaN.
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the worlds largest dedicated semiconductor foundry ever since. The company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 272 distinct process technologies, and manufactured 10,761 products for 499 customers in 2019 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.